Thermal expansion coefficient and thermal fatigue of discontinuous carbon fiber-reinforced copper and aluminum matrix composites without interfacial chemical bond
2014
Lalet, Grégory | Kurita, Hiroki | Heintz, Jean-Marc | Lacombe, Guillaume | Kawasaki, Akira | Silvain, J.-F. (Jean-François)
Fully dense carbon fiber-reinforced copper and aluminum matrix (Cu–CF and Al–CF) composites were fabricated by hot press without the need for an interfacial chemical compound. With 30 vol% carbon fiber, the thermal expansion coefficients (TECs) of pure Cu and Al were decreased to 13.5 × 10⁻⁶and 15.5 × 10⁻⁶/K, respectively. These improved TECs of Cu–CF and Al–CF composites were maintained after 16 thermal cycles; moreover, the TEC of the 30 vol% Cu–CF composite was stable after 2500 thermal cycles between −40 and 150 °C. The thermal strain caused by the TEC mismatch between the matrix and the carbon fiber enables mechanical enhancement at the matrix/carbon fiber interface and allows conservation of the improved TECs of Cu–CF and Al–CF composites after thermal cycles.
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