Thermophysical parameters of corn and wheat flour
2003
Bozikova, M. (Slovenska Polnohospodarska Univ., Nitra (Slovak Republic). Mechanizacna Fakulta)
Thermophysical properties of corn and wheat flours were evaluated using an Isomet apparatus measuring flour temperature, thermal conductivity and thermal diffusivity. Relations between these values and flour bulk density and moisture content were determined. The values of thermal conductivity and thermal diffusivity of both flours increased linearly with increasing moisture content. The values of thermal conductivity increased with increasing density, while thermal diffusivity values decreased with increasing bulk density. Both functions were polynomial. All the functions were influenced by the type of the flour.
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