Review of cooling solutions for compact electronic devices
2019
Galins, J., Latvia Univ. of Life Sciences and Technologies, Jelgava (Latvia) | Laizans, A., Latvia Univ. of Life Sciences and Technologies, Jelgava (Latvia) | Galins, A., Latvia Univ. of Life Sciences and Technologies, Jelgava (Latvia)
Nowadays, with the rapid development of robotics and automation, there is a need for more powerful, more compact data processing equipment that also emits more heat. Various electronics cooling solutions are already in use, others are in development. Each cooling solution has its advantages and disadvantages. Active cooling usually dissipates heat more efficiently, but passive cooling is more reliable, especially when the electrical system is exposed to aggressive environmental influences. The possibility of using graphene in the manufacture of electrical equipment components is widely studied. Graphene could significantly improve the efficiency of passive cooling because its thermal conductivity is much better than copper.
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