Excavation of Genes Response to Heat Resistance by Transcriptome Analysis in Bottle Gourd (<i>Lagenaria siceraria</i> (Mol.) Standl.)
2024
Min Wang | Wenrui Liu | Qingwu Peng | Shaoqi Shi | Ying Wang | Liqin Cao | Biao Jiang | Yu’e Lin | Tianyue Zhao | Xiaojuan Cui | Songguang Yang
Heat stress, as a negative factor, severely threatens the quality and production of bottle gourd, which prefers to grow in a warm environment. To understand which genes are involved in the resistance to heat stress in bottle gourd (<i>Lagenaria siceraria</i> (Mol.) Standl.), we analyzed the characteristics of two genetic bottle gourd varieties, “Mei feng”-MF (heat resistant) and “Lv long”-LL (heat sensitive). Under heat stress, MF plants exhibited a higher survival rate, lower relative electrolytic leakage, and decreased stomatal aperture compared with LL. In addition, RNA-Seq was carried out on the two varieties under normal conditions and heat stress. The results revealed a total of 1485 up-regulated and 946 down-regulated genes under normal conditions, while 602 genes were up-regulated and 1212 genes were down-regulated under heat stress. Among these genes, several differentially expressed genes (DEGs) involved in the MAPK (mitogen-activated protein kinase) signaling pathway and members of bHLH (basic helix-loop-helix) transcription factors showed significant up- or down-regulation after heat stress. Next, to validate these findings, we conducted quantitative real-time PCR (qRT-PCR) analysis, which confirmed the expression patterns of the genes detected through RNA-Seq. Collectively, the DEGs between the two contrasting cultivars identified in our study provide novel insight into excavating helpful candidate genes associated with heat tolerance in bottle gourd.
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