Wood adhesion, the past 10 years and the future
2010
Takemura, A., Tokyo Univ. (Japan)
The major change in wood adhesion during the past decade was developing the adhesives for countermeasure against emission of formaldehyde and VOC. The emission of formaldehyde from wood-based materials has cleared the reference level of Ministry of Land, Infrastructure, Transport and Tourism by using above adhesives. It is considered that future adhesives will be more environment-conscious, such as sick-house countermeasure adhesives, adhesives from nonfossil resources, and dismantlable adhesives, which were described and commented on from the authors' standpoint. Here some of the current and author's concept are described. The concept of gecko's foot is good for developing new adhesives, and has great potential to lead us to new future adhesives.
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