Finite element simulation of corn moisture adsorption
1996
Muthukumarappan, K. | Gunasekaran, S.
Thin-layer moisture adsorption tests were conducted by exposing corn kernels to different air relative humidities (RH of 75, 80, and 90%) and temperatures (25, 30, 35, and 40 degrees C). A two-dimensional finite element model was developed to simulate moisture diffusion into a corn kernel during adsorption. The finite element model satisfactorily predicted experimental moisture ratio of corn samples and performed better than the analytical model in predicting the adsorption behavior of corn kernels. Moisture profiles predicted with the finite element model showed that the moisture gradient between the center and boundary of a corn kernel exposed to air at 25, 30, and 35 degrees C each at 90% RH was about 4% after one hour and reached a maximum of about 9% after 7.5 h and declined during subsequent adsorption.
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