Thermal conductivity of thermal-treated Japanese cedar board
2009
Toyono, M.(Tokyo Univ. (Japan)) | Saito, Y. | Shida, S.
Thermal conductivity of thermal-treated flat-grain Japanese cedar board was measured by the comparison method. The vacuum condition below 10 mmHg of air pressure and temperatures, 185, 220 and 237degC, and duration time, 1, 1.5, and 5 hours were applied for thermal treatment. Thermal conductivities decreased as temperature became higher and duration time of thermal treatment became longer. Thermal conductivity of Japanese cedar after thermal treatment was ranged from 0.004 to 0.005 W/mK. These values are equivalent as the value of glass wool insulation material which has 16 kg/cubic m density. Thermal treatment made the density of wood substance lower, void volume larger in a board and equilibrium moisture content lower comparing to normal wood. These results are the reasons why thermal conductivity of thermal-treated board became low.
Afficher plus [+] Moins [-]Mots clés AGROVOC
Informations bibliographiques
Cette notice bibliographique a été fournie par Agriculture, Forestry and Fisheries Research Information Technology Center
Découvrez la collection de ce fournisseur de données dans AGRIS