Parallel Near-Field Photolithography with Metal-Coated Elastomeric Masks
2015
Wu, Jin | Yu, Cheng-han | Li, Shaozhou | Zou, Binghua | Liu, Yayuan | Zhu, Xiaoqun | Guo, Yuanyuan | Xu, Hongbo | Zhang, Weina | Zhang, Liping | Liu, Bin | Tian, Danbi | Huang, Wei | Sheetz, Michael P. | Huo, Fengwei
Developing a cost-effective nanolithography strategy that enables the production of subwavelength features with various shapes over large areas is a long-standing goal in the nanotechnology community. Herein, an inexpensive nanolithographic technique that combines the wafer-scale production capability of photolithography with the subwavelength feature size controllability of near-field photolithography was developed to fabricate centimeter-scale up to wafer-scale sub-100-nm variously shaped nanopatterns on surfaces. The wafer-scale elastomeric trench-based photomasks with subwavelength apertures created at the apexes were compatible with mask aligners, allowing for the production of wafer-scale subwavelength nanopatterns with adjustable feature sizes, shapes, and periodicities. The smallest feature sizes of 50 and 80 nm were achieved on positive tone and negative tone photoresist surfaces, respectively, which could be ascribed to a near-field optical effect. The fabricated centimeter-scale nanopatterns were functionalized to study cell–matrix adhesion and migration. Compared to currently developed nanolithographic methods that approach similar functionalities, this facile nanolithographic strategy combines the merits of low cost, subwavelength feature size, high throughput, and varied feature shapes, making it an affordable approach to be used in academic research for researchers at most institutions.
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