Fenton-based treatment of electroless copper plating waste for organics mineralization and CuO recovery
2019
NavarroCurrent address: Microbial Technology Laboratory, Department of Forest Resource Chemistry, Forestry and Forest Products Research Institute, Tsukuba 305-8687, Japan, Ronald R. | Ichikawa, Hiroyasu | Tatsumi, Kenji
Fenton-based oxidation was used to treat an actual electroless copper plating waste solution containing a mixture of organic compounds including tartaric acid, formaldehyde and formic acid. As a novel advancement, the naturally present Cu(ii) ions were directly used as a catalyst. An external metal ion, particularly Fe(ii), was not required and only hydrogen peroxide was added to generate oxidizing hydroxyl radicals. During treatment, a substantial increase in solution temperature was observed as a result of tartaric acid degradation and the highly exothermic process enhanced the decomposition of formaldehyde and formic acid. The major organic components were completely mineralized, leaving only a small amount of oxalic acid. By the Cu-Fenton, close to 99% TOC and COD removal was achieved. The high temperature oxidation also led to the almost complete removal (<0.1 ppm residual) and recovery of Cu ions as a low volume CuO precipitate during alkalinization.
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