Daya Simpan Wafer Mengandung Tumpi Jagung Pada Suhu dan Konsentrasi Pengawet Asam Propionat Berbeda | Shelf Life Wafers Contain Corn Tumpi at Different Temperatures and Concentrations of Propionic Acid Preservatives

Wafer merupakan teknologi pengolahan pakan yang dapat mempertahankan kualitas pakan. Daya simpan sangat penting untuk diketahui dengan tujuan menjaga kualitas nutrisi pakan hingga dikonsumsi ternak. Penelitian ini bertujuan menganalisis pengaruh suhu penyimpanan dan penambahan pengawet asam propionat terhadap daya simpan wafer mengandung tumpi jagung. Penelitian ini terdiri dari 3 faktor yaitu suhu penyimpanan (27oC, 40oC, 50oC), lama penyimpanan (1, 5, 10, 15, 20, 25, 30 hari), dan persentase asam propionat (0%, 1%, 2%) dengan 3 ulangan. Data uji fisik di analisis menggunakan analisis ragam (ANOVA), jika berbeda nyata dilanjut dengan uji Duncan. Hasil penelitian menunjukkan bahwa perlakuan suhu, lama penyimpanan, dan persentase asam propionat berpengaruh nyata (P<0,05) terhadap daya simpan wafer. Suhu yang tinggi dapat menurunkan kadar air, aktivitas air, durabilitas, dan meningkatkan bilangan peroksida. Penambahan asam propionat dapat menekan peningkatan kadar air, aktivitas air, serangan serangga, dan bilangan peroksida. Wafer pada suhu 27oC dengan asam propionat 2% memiliki daya simpan yang baik hingga penyimpanan hari ke-25.

Wafer is a feed processing technology that can maintain feed quality. Shelf life is very important to know with the aim of maintaining the nutritional quality of feed to livestock consumption. This study aimed to analyze the effect of storage temperature and the addition of propionic acid preservative on the shelf life of wafers containing corn mash. This study consisted of 3 factors, namely storage temperature (27oC, 40oC, 50oC), storage duration (1, 5, 10, 15, 20, 25, 30 days), and percentage of propionic acid (0%, 1%, 2%) with 3 repeats. Physical test data were analyzed using analysis of variance (ANOVA), if significantly different continued with the Duncan test. The results showed that the temperature treatment, storage duration, and percentage of propionic acid had a significant effect (P<0.05) on the shelf life of the wafer. High temperatures could decrease moisture content, water activity, durability, and increase peroxide number. The addition of propionic acid could suppress increases in water content, water activity, insect attack, and peroxide number. Wafers at 27oC with 2% propionic acid had good shelf life until the 25th day of storage.

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