Occurrence State and Dissolution Mechanism of Metallic Impurities in Diamond Wire Saw Silicon Powder
2020
Yang, Shicong | Wan, Xiaohan | Wei, Kuixian | Ma, Wenhui | Wang, Zhi
The facilitation of metallic impurities removal via acid leaching pretreatment plays a key role in silicon recovery from diamond wire saw silicon powder (DWSSP) waste. Disappointingly, the occurrence state and dissolution mechanism of the metallic impurities present in DWSSP have not yet been revealed. For this reason, in this study, three different kinds of raw DWSSP were used for acid leaching tests and leaching behavior verification to investigate the dissolution mechanism. After two-stage acid leaching with 4 M HCl and 2 M HCl + 2.5 M HF, the results indicate that the removal efficiency was superior to that of other previously reported leaching processes. Furthermore, two occurrence states of metallic impurities present in DWSSP were defined based on their different dissolution behaviors, and the intrinsic relationship between dissolution behavior and the thinning process of the amorphous SiO₂ shell was derived. The findings indicate that the first type of impurity was more easily dissolved in HCl solution; however, the second type of retained metallic impurity was restricted by the SiO₂ shell barrier and was removed by the added HF solution. For this reason, the disintegration dissolution of the amorphous SiO₂ shell was found to have a significant impact on the facilitation of the removal of impurities retained in DWSSP. The findings of this study are significant for the recovery of silicon from DWSSP with an effective acid leaching flow design.
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