Effect of manufacturing parameters on the linear expansion and density profile of particleboard
1998
Suzuki, Shigehiko | Miyamoto, Kohta
Particleboards were fabricated in the laboratory with different board densities and resin contents to evaluate linear expansion when exposed to both vapor and liquid water. Density profiles were measured to determine the relation to the elastic constants and to the dimensional properties of the boards. It was found that density profiles were affected by the board density and resin content applied. The high-density layer formed in the thickness direction affected the elastic constant measurements. A model introduced to predict the linear expansion closely matched the data during exposure to water. Under conditions of 40°C and 90% humidity, linear expansion increased with increasing board density. An increase in resin content from 6% to 12% slightly increased the linear expansion and decreased the thickness swelling. A linear relation was found between board density and linear expansion per unit of moisture content change.
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