Influence of non-homology between recombining DNA sequences on double-strand break repair in Saccharomyces cerevisiae
1995
Glasunov, A. | Frankenberg-Schwager, M. | Frankenberg, M. (Institute for Genetics of Industrial Microorganisms, Moscow (Russian Federation))
In this paper the influence of nonhomology between plasmid and chromosomal DNA on the efficiency of recombinational repair of plasmid double-strand breaks and gaps in yeast is studied. For this purpose different combinations of plasmids and yeast strains carrying various deletions within the yeast LYS2 gene were used. A 400 bp deletion in plasmid DNA had no effect on recombinational plasmid repair. However, a 400 bp deletion in chromosomal DNA dramatically reduced the efficiency of this repair mechanism, but recombinational repair of plasmids linearized by a double-strand break with cohesive ends still remained the dominant repair process. The competition between recombination and ligation in the repair of linearized plasmids was studied. The experimental evidence suggests that recombinational repair is attempted but aborted if only one recombinogenic end with homology to chromosomal DNA is present in plasmid DNA. This situation results in a decreased probability of non-recombinational (i.e. ligation) repair of linearized plasmid DNA.
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