Paper birch as a core material for aspen oriented strandboard and waferboard
1992
Chen, Y. | Popowitz, B.A. | Gertjejansen, R.O. | Ritter, D.C.
Three-inch-long paper birch strands and wafers of two widths and two thicknesses were used for the cores (33% by weight) of laboratory phenol-formaldehyde-bonded aspen oriented strandboards (OSB) and waferboards over a density range of 37 to 43 pcf. Properties evaluated were internal bond (IB), moduli of elasticity (MOE) and rupture (MOR), and, after a 2-hour boil bond durability test, thickness swelling (TS), linear expansion, and loss of MOR. For the critical properties of IB, TS, and ITS, panels from thin-wide birch core strands and wafers were statistically superior to the all-aspen panels, with the exception of the OSB IBs, which were statistically equal. Thick birch core geometries generation generationally had deleterious effects on the critical core properties of IB, TS, and ITS. Geometry of core strands and wafers had little or no influence on MOR and MOE.
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