Stretchable Printed Circuit Board Based on Leak-Free Liquid Metal Interconnection and Local Strain Control
2021
Kim, Min Seong | Kim, Seunghwan | Choi, Jungrak | Kim, Seonggi | Han, Chankyu | Lee, Yung | Jung, Youngdo | Park, Jaeho | Oh, Sunjong | Bae, Byeong-Soo | Lim, Hyuneui | Park, Inkyu
In order to realize a transition from conventional to stretchable electronics, it is necessary to make a universal stretchable circuit board in which passive/active components can be robustly integrated. We developed a stretchable printed circuit board (s-PCB) platform that enables easy and reliable integration of various electronic components by utilizing a modulus-gradient polymeric substrate, liquid metal amalgam (LMA) circuit traces, and Ag nanowire (AgNW) contact pads. Due to the LMA–AgNW biphasic structure of interconnection, the LMA is hermetically sealed by a homogeneous interface, realizing complete leak-free characteristics. Furthermore, integration reliability is successfully achieved by local strain control of the stretchable substrate with a selective glass fiber reinforcement (GFR). A strain localization derived by GFR makes almost 50,000% of strain difference within the board, and the amount of deformation applied to the constituent elements can be engineered. We finally demonstrated that the proposed integrated platform can be utilized as a universal s-PCB capable of integrating rigid/conventional electronic components and soft material-based functional elements with negligible signal distortion under various mechanical deformations.
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