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Restriction of liquid water spreading in overlaid plywood top veneer
2018
Cirule, D., Latvian State Inst. of Wood Chemistry, Riga (Latvia) | Kuka, E., Latvian State Inst. of Wood Chemistry, Riga (Latvia);Riga Technical Univ. (Latvia) | Verovkins, A., Latvian State Inst. of Wood Chemistry, Riga (Latvia) | Andersone, I., Latvian State Inst. of Wood Chemistry, Riga (Latvia)
Plywood overlaid with resin impregnated paper films is used in various decorative applications for which high stability of aesthetic qualities is of great importance. The top veneer of the plywood for these materials is perfectly protected from a direct contact with water as far as the covering film is not damaged. However, in case of film damage water can cause clearly visible defects in a relatively short period of time. To reduce these types of defects, unsophisticated and efficient way was developed. It involves filling the vessel system of the top veneer with industrial phenol-formaldehyde resin by using a hot-press. Influence of some phenol-formaldehyde resin properties on its penetration in birch veneer as well as the effect of wood moisture content were tested. The proposed top veneer pre-treatment method with phenol-formaldehyde resin reduced the average swelling zone distance from damage site by half for oven pre-dried plywood with 3% moisture content before treatment. Moreover, it was found that using plywood with moisture content of 9% the swelling zone distance was reduced by two thirds compared to untreated overlaid plywood.
Mostrar más [+] Menos [-]Organoclay additive for plywood protection against brown and white rot fungi
2018
Zommere, Z., Latvian State Inst. of Wood Chemistry, Riga (Latvia) | Irbe, I., Latvian State Inst. of Wood Chemistry, Riga (Latvia) | Grinins, J., Latvian State Inst. of Wood Chemistry, Riga (Latvia) | Rudzite, S., Latvijas Finieris, AS, Riga (Latvia) | Nikolajeva, V., University of Latvia, Riga (Latvia)
In this study, antifungal properties of an organoclay additive were investigated. Two types of organoclay (red and white) were tested in Petri dishes to determine their toxicity against the brown rot fungus Coniophora puteana and the white rot fungus Trametes versicolor. Red organoclay was more efficient than the white one and, depending on the fungus, inhibited or stopped the fungal growth. Red organoclay was chosen as an additive to produce a new type of plywood product. Biological durability of this plywood product was determined according to the methods: NF B 51-295 (bending strength test) and LVS ENV 12038:2002 (mass loss test). The loss in bending strength exceeded 81% and 65% after exposure to brown and white rot fungi, respectively. The mass loss of the plywood product after the decay test was higher than 3%, which defined the material as not fully resistant against decay fungi. According to CEN/TS 15083-1:2005, the plywood product corresponded to the durability class 3 (moderately durable) to 5 (not durable) depending on the fungus.
Mostrar más [+] Menos [-]Birch plywood sample tension and bending property investigation and validation in SolidWorks environment
2018
Zalcmanis, A., Latvijas Finieris, AS, Riga (Latvia) | Zudrags, K., Latvijas Finieris, AS, Riga (Latvia) | Japins, G., Riga Technical Univ. (Latvia)
Birch plywood has proved itself to be one of the most rational ways of wood processing. Growing demand of high performance birch plywood products requires a complex numerical analysis based on Finite Element Method (FEM), instead of using simple analytical assumptions, which prevent optimization of plywood construction (lay-up). In the research samples of birch plywood of several thicknesses, both sanded and non-sanded, with fibre direction of external veneer both in the longitudinal and transverse directions were tested. An extensometer and optical strain gauge were used for strain measurement. The FEM analysis, using commercial software SolidWorks Simulation Premium (SW), versus experimental bending and tension testing according to LVS EN 789 was carried out in this paper. The analysis of results indicates that there is a high correlation between the results of the experiments and the FEM. Particularly for in tension loaded specimens one can be tested up to the maximum ply strength (100 MPa); meanwhile, in bending up to 71MPa – the average stress in load bearing ply at the proportionality limit. Due to software restrictions, shear stresses cannot be evaluated. Future studies are considered to investigate terms for designing plywood with dynamic properties of strength and stiffness to be taken into account.
Mostrar más [+] Menos [-]Relationship of birch (Betula sp.) plywood bending properties determined according to the European standards EN 789 and EN 310
2007
Zudrags, K., Latvia Univ. of Agriculture, Jelgava (Latvia) | Tuherm, H., Latvia Univ. of Agriculture, Jelgava (Latvia)
The manufacturers of wood-based panels are interested to get easy and cheap method for determination of characteristic values of panels. The correlation between European standards EN 789 and EN 310 tests results can be used as an alternative procedure for determination of characteristic values of bending properties. The correlations between two results of bending properties determined by testing methods of European standards EN 789 and EN 310 are studied in this paper. The ratio of EN 789 test results divided with EN 310 test results (ratio of EN 789/EN 310), depending on panel thickness and glue type, was examined. Samples from 846 panels of birch (Betula sp.) plywood with thickness ranging from 6.5 to 30 mm and two glue types - phenol formaldehyde and melamine urea formaldehyde resin - were used for verification of the correlations. The results show that the panel thickness influences the ratio of EN 789/EN 310 and the highest ratio were found between 12 and 15 mm panels. When the panel thickness is increased or decreased, the ratio of EN 789/EN 310 decreases significantly. The regression equations for each thickness of plywood are presented. The difference between plywood glued with phenol formaldehyde and melamine urea formaldehyde resin glues was not found.
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