FAO AGRIS - International System for Agricultural Science and Technology

The rheology and microstructure of composite wheat dough enriched with extruded mung bean flour

2019

Meng, Yuejiao | Guan, Xiao | Liu, Xingli | Zhang, Hua


Bibliographic information
Lebensmittel-Wissenschaft + Technologie
Volume 109 Pagination 378 - 386 ISSN 0023-6438
Publisher
Elsevier Ltd
Other Subjects
Starch granules; Bean flour; Pasting properties; Dough; Storage modulus; Loss modulus; Pasting properties; Retrogradation; Elastic deformation; Mung bean flour; Sem
Language
English
Type
Journal Article; Text

2024-02-28
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