AGRIS - 国际农业科技情报系统

The rheology and microstructure of composite wheat dough enriched with extruded mung bean flour

2019

Meng, Yuejiao | Guan, Xiao | Liu, Xingli | Zhang, Hua


书目信息
Lebensmittel-Wissenschaft + Technologie
109 页码 378 - 386 ISSN 0023-6438
出版者
Elsevier Ltd
其它主题
Starch granules; Bean flour; Pasting properties; Dough; Storage modulus; Loss modulus; Pasting properties; Retrogradation; Elastic deformation; Mung bean flour; Sem
语言
英语
类型
Journal Article; Text

2024-02-28
MODS